Patent Assignment
Reel/Frame 063987/0751
Assignment of Assignor's Interest
Recorded: 2023-06-19
Pages: 4
Assignors
TZENG, JIANN-TYNG
Executed: 2022-03-06
PENG, SHIH-WEI
Executed: 2022-02-20
SHEN, MENG-HUNG
Executed: 2022-02-21
LAI, WEI-AN
Executed: 2023-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Structure and Method for Tying Off Dummy Gate in Semiconductor Device