Patent Assignment
Reel/Frame 063990/0502
Assignment of Assignor's Interest
Recorded: 2023-06-20
Pages: 6
Assignors
GUO, JIANQIANG
Executed: 2023-05-19
LUO, WENJUN
Executed: 2023-05-25
LI, MINGCHUAN
Executed: 2023-05-19
Assignee
HONOR DEVICE CO., LTD.
SUITE 3401, UNIT A, BUILDING 6, SHUM YIP SKY PARK, NO. 8089, HONGLI WEST ROAD, XIANGMIHU STREET, FUTIAN DISTRICT, SHENZHEN, 518040, CHINA
Covered Property
(1)
Circuit Board Assembly Soldering Apparatus and Circuit Board Assembly Soldering Method