Patent Assignment
Reel/Frame 064019/0651
Assignment of Assignor's Interest
Recorded: 2023-06-21
Pages: 4
Assignors
YANG, FAN
Executed: 2023-05-23
GUO, JIANQIANG
Executed: 2023-05-23
LI, MINGCHUAN
Executed: 2023-05-23
Assignee
HONOR DEVICE CO., LTD.
SUITE 3401, UNIT A, BUILDING 6, SHUM YIP SKY PARK, NO. 8089, HONGLI WEST ROAD, XIANGMIHU STREET, FUTIAN DISTRICT, SHENZHEN, GUANGDONG, 518040, CHINA
Covered Property
(1)
Circuit Board Assembly, Manufacturing Method, and Electronic Device
Application:
18/022,376 →
Publication:
US 2024/0179845