Patent Assignment
Reel/Frame 064021/0717
Assignment of Assignor's Interest
Recorded: 2023-06-21
Pages: 3
Assignors
CHUNG, CHENG-TING
Executed: 2023-06-13
LIAO, YI-BO
Executed: 2023-06-13
CAI, JIN
Executed: 2023-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure Including Different Devices and Methods for Manufacturing the Same
Application:
18/339,076 →
Publication:
US 2024/0429299