Patent Assignment
Reel/Frame 064025/0504
Assignment of Assignor's Interest
Recorded: 2023-06-22
Pages: 6
Assignors
CHOI, JINSEO
Executed: 2023-04-20
LEE, SOHYANG
Executed: 2023-04-20
JIN, JEONGMIN
Executed: 2023-04-20
CHOI, SOHEE
Executed: 2023-04-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device