Patent Assignment
Reel/Frame 064031/0855
Assignment of Assignor's Interest
Recorded: 2023-06-22
Pages: 7
Assignors
NAKAMURA, TOSHIMI
Executed: 2023-05-08
KOMIYA, MIKIKO
Executed: 2023-05-16
MATSUURA, YOSHINORI
Executed: 2023-05-08
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Wiring Substrate, Method of Trimming Same, and Multi-Layered Wiring Board
Application:
18/269,104 →
Publication:
US 2024/0080990
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.