Patent Assignment
Reel/Frame 064043/0057
Assignment of Assignor's Interest
Recorded: 2023-06-23
Pages: 5
Assignor
RIVIERE, JEAN-MICHEL
Executed: 2023-06-02
Assignee
STMICROELECTRONICS (GRENOBLE 2) SAS
12 RUE JULES HOROWITZ, GRENOBLE, 38000, FRANCE
Covered Property
(1)
Systems, Apparatuses, and Methods for Back-to-Back Die for Semiconductor Packages
Application:
18/204,092 →
Publication:
US 2024/0404963
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.