Patent Assignment
Reel/Frame 068449/0739
Assignment of Assignor's Interest
Recorded: 2024-08-30
Pages: 7
Assignor
STMICROELECTRONICS (GRENOBLE 2) SAS
Executed: 2024-08-19
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(35)
Microprocessor with Floating-Point Cordic Instructions
Application:
18/305,869 →
Publication:
US 2024/0354056
Secure Communications
Application:
18/636,882 →
Publication:
US 2024/0356753
Radio Communication Method and System
Optical Device
Application:
18/668,442 →
Publication:
US 2024/0391229
Asynchronous State Machine for a Switching Converter
Method for Calibrating a Switching Converter
Application:
18/597,428 →
Publication:
US 2024/0305197
Control of the Brightness of a Display
Application:
18/651,950 →
Publication:
US 2024/0377539
Memory Device of the Phase-Change Type and Method for Reading Such a Device
Application:
18/660,938 →
Publication:
US 2024/0386955
Optical Package with Electromagnetic Shielding
Application:
18/618,447 →
Publication:
US 2024/0332210
Interface Circuit and Method
Device and Circuit for Measuring a Derivative
Application:
18/583,474 →
Publication:
US 2024/0322802
Circuit and Method for Interfacing with Peripheral Circuits
Patent:
12,619,555 →
Application:
18/617,982 →
Method for Reading a Multi-Level Non-Volatile Memory Device, in Particular a Phase-Change Memory Device, and Multi-Level Non-Volatile Memory Device
Application:
18/660,651 →
Publication:
US 2024/0386954
Electronic Device
Application:
18/616,696 →
Publication:
US 2024/0332162
Electronic Device
Application:
18/601,216 →
Publication:
US 2024/0321809
Charge Pump Regulator
Emulation Process and Circuit for a Read-Only Memory
Application:
18/618,299 →
Publication:
US 2024/0330518
Optical Sensor with Integrated Leadframe Cap
Application:
18/350,406 →
Publication:
US 2025/0020779
Wafer Level Proximity Sensor and Method of Making Same
Systems, Apparatuses, and Methods for Back-to-Back Die for Semiconductor Packages
Application:
18/204,092 →
Publication:
US 2024/0404963
Heat Sink Fastened on the Substrate of a Package of Integrated Circuits
Application:
18/624,320 →
Publication:
US 2024/0339375
Area Saving High Coverage Fast Diagnosis Memory Scan Design
Application:
63/461,981 →
Area Saving High Coverage Fast Diagnosis Memory Scan Design
Method for Controlling an Envelope Shape of an Output Signal Outputted by a Driver of a Wireless Transmitter, and Corresponding Integrated Circuit
Application:
18/436,510 →
Publication:
US 2024/0275335
Method and Device for Near Field Communication Wireless Charging Transmitter
Application:
18/634,476 →
Publication:
US 2024/0372383
Non-Invasive Vital Signs Monitoring on a Mobile Device Using an Under-Display Optical Sensor
Application:
18/339,480 →
Publication:
US 2024/0423545
Quadrature Oscillator
Nfc Controller
Application:
18/646,177 →
Publication:
US 2024/0364386
Method, Systems, and Apparatuses for Electromagnetic Shielding
Patent:
11,974,419 →
Application:
18/209,018 →
Systems, Apparatuses, and Methods for Nanowires for Semicondcutor Packages
Application:
18/207,918 →
Publication:
US 2024/0413043
Level Shifting Circuit
Thermally Enhanced Flip Chip Ball Grid Array Package with Improved Heat Dissipation
Application:
18/375,716 →
Publication:
US 2025/0112110
Thermally Enhanced Electro-Optical Device
Application:
18/584,492 →
Publication:
US 2025/0273530
Flicker Noise Free Bandgap Reference Voltage Generator Circuit
Determining Contribution of Display Screen Brightness to Ambient Light Measurements in a Display Environment
Application:
18/526,597 →
Publication:
US 2025/0180402
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 24, 2023
From: GOBIN, PIERRE
To: STMICROELECTRONICS (ALPS) SAS
Reel/Frame 063419/0928 →
Assignment of Assignor's Interest
Apr 24, 2023
From: RIBEIRO DE FREITAS, JEREMY
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 063420/0016 →
Assignment of Assignor's Interest
Apr 26, 2023
From: VERMA, PRAVEEN KUMAR; LECOCQ, CHRISTOPHE; VADERIYA, YAGNESH DINESHBHAI; DHILLON, ANUJ
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063447/0344 →
Assignment of Assignor's Interest
Jun 23, 2023
From: RIVIERE, JEAN-MICHEL
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 064043/0057 →
Assignment of Assignor's Interest
Jun 28, 2023
From: SAUGIER, ERIC
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 064094/0374 →
Assignment of Assignor's Interest
Jul 11, 2023
From: NUYTS, DOMINIQUE; LAURENT, PATRICK
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 064215/0001 →
Quitclaim Assignment
Feb 22, 2024
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066647/0361 →
Assignment of Assignor's Interest
Feb 22, 2024
From: CAMIOLO, JEAN; GODET, GEOFFROY
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066533/0462 →
Assignment of Assignor's Interest
Mar 7, 2024
From: CHESNEAU, DAVID
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066677/0575 →
Assignment of Assignor's Interest
Mar 7, 2024
From: CHESNEAU, DAVID
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066677/0607 →
Assignment of Assignor's Interest
Mar 11, 2024
From: COFFY, ROMAIN; AUCHERE, DAVID; VELAYUDHAN, VIPIN
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066716/0363 →
Assignment of Assignor's Interest
Mar 26, 2024
From: ESCALLIER, CEDRIC
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066896/0957 →
Assignment of Assignor's Interest
Mar 26, 2024
From: DEROO, JEROME
To: STMICROELECTRONICS (ALPS) SAS
Reel/Frame 066902/0159 →
Assignment of Assignor's Interest
Mar 26, 2024
From: PAGANINI, ANDREA; REPOSSI, MATTEO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 066902/0067 →
Assignment of Assignor's Interest
Mar 26, 2024
From: GASIOT, GILLES
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 066901/0994 →
Assignment of Assignor's Interest
Mar 26, 2024
From: THIES, WILLIAM
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066901/0925 →
Assignment of Assignor's Interest
Mar 26, 2024
From: LECOCQ, CHRISTOPHE
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 066896/0843 →
Assignment of Assignor's Interest
Mar 27, 2024
From: LAURENT, PATRICK; RIVIERE, JEAN-MICHEL
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066922/0675 →
Assignment of Assignor's Interest
Mar 27, 2024
From: SUSELLA, RUGGERO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 066921/0572 →
Assignment of Assignor's Interest
Mar 27, 2024
From: ANQUET, NICOLAS
To: STMICROELECTRONICS (ALPS) SAS
Reel/Frame 066921/0356 →
Assignment of Assignor's Interest
Mar 27, 2024
From: PELISSIER, GILLES
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066921/0222 →
Assignment of Assignor's Interest
Mar 27, 2024
From: PELISSIER, GILLES
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066917/0517 →
Assignment of Assignor's Interest
Mar 27, 2024
From: ANQUET, NICOLAS
To: STMICROELECTRONICS (ALPS) SAS
Reel/Frame 066916/0551 →
Assignment of Assignor's Interest
Mar 27, 2024
From: ANQUET, NICOLAS
To: STMICROELECTRONICS (ALPS) SAS
Reel/Frame 066915/0456 →
Assignment of Assignor's Interest
Mar 27, 2024
From: PELISSIER, GILLES
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 066916/0509 →