IP Library › Granted Patent US 12,721,160
Granted Patent B2
US 12,721,160 · App. 18/375,716 · Granted Aug 25, 2026

Thermally enhanced flip chip ball grid array package with improved heat dissipation

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Quick Facts
Patent No.
US 12,721,160
App. No.
18/375,716
Filed
Oct 2, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2812
USPC
257/713
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2024
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068449/0739 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2023
From: PERMINJAT, FLORIAN; DE MORO, FABRICE
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 065093/0759 →
Continuity (1)
Related Publication 20250112110A1 · Apr 3, 2025
References Cited (14)
US 9355985B2 · Vincent · 2016 [cited by examiner]
US 9698132B1 · Ady · 2017 [cited by examiner]
US 20140015106A1 · Hsieh et al. · 2014 [cited by applicant]
US 20160049349A1 · Lane et al. · 2016 [cited by applicant]
US 20180358280A1 · Gandhi · 2018 [cited by examiner]
US 20200051888A1 · Lin · 2020 [cited by examiner]
US 20200098666A1 · Wan et al. · 2020 [cited by applicant]
US 20220037229A1 · Chen · 2022 [cited by examiner]
US 20220310474A1 · Yeh · 2022 [cited by examiner]
US 20230119181A1 · Kim · 2023 [cited by examiner]
US 20230411173A1 · Kuo · 2023 [cited by examiner]
US 20250105085A1 · Nasr · 2025 [cited by examiner]
Radian Thermal Products, Inc.: “EZ Snap Clip for BGA Heatskins—Radian Thermal,” 2023, 10 pgs. [cited by applicant]
NXP: “AN13656, Assembly Guidelines for Flip Chip Plastic Ball Grid Array and Chip Scale Package,” Rev. 1—Sep. 1, 2022, Application Note, 38 pgs. [cited by applicant]