Patent Assignment
Reel/Frame 065093/0759
Assignment of Assignor's Interest
Recorded: 2023-10-02
Pages: 4
Assignee
STMICROELECTRONICS (GRENOBLE 2) SAS
12 RUE JULES HOROWITZ, GRENOBLE, 38000, FRANCE
Covered Property
(1)
Thermally Enhanced Flip Chip Ball Grid Array Package with Improved Heat Dissipation
Application:
18/375,716 →
Publication:
US 2025/0112110
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.