HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRCUITS

1 . An integrated circuit package, comprising:

a support substrate; and

a heat sink including a lateral wall fastened on a mounting face of the support substrate by fastening devices;

wherein the fastening devices are accommodated in compartments of the lateral wall and cross the support substrate through first orifices; and

wherein the fastening devices and the first orifices are configured to enable fastening of the lateral wall on the mounting face and a relative movement of the fastening devices relative to the first orifice.

2 . The package according to claim 1 , wherein the support substrate includes a lower face opposite to the mounting face and wherein the fastening devices comprise rivets, each rivet comprising a first end accommodated in a corresponding compartment and a second end under the lower face of the support substrate, wherein a distance between the first end and the second end is equal to a thickness of the support substrate increased by a clearance enabling both holding of the lateral wall fastened to the mounting face of the support substrate and movement of each rivet in the first orifice.

3 . The package according to claim 2 , wherein the value of the clearance is comprised between 10 and 20 μm.

4 . The package according to claim 1 , wherein the support substrate includes a lower face opposite to the mounting face and wherein the compartments are threaded and the fastening devices comprise screws configured to be screwed into the threaded compartments while leaving a clearance between the screw heads and the lower face of the support substrate.

5 . The package according to claim 4 , wherein the value of the clearance is comprised between 10 and 20 μm.

6 . The package according to claim 1 , wherein the first orifices have an oblong shape.

7 . The package according to claim 6 , wherein an axis of each first orifice with the oblong shape in the plane of the mounting face forms a 45° angle with respect to the direction of the two edges of the lateral wall adjacent to this first orifice.

8 . The package according to claim 1 , wherein the lateral wall of the heat sink has an annular shape with a square or rectangular section, and the support substrate includes four first orifices respectively located opposite four corner areas of the lateral wall.

9 . The package according to claim 1 , wherein the fastening devices are thermally-conductive.

10 . The package according to claim 1 . wherein the support substrate has a thermal expansion coefficient comprised between 10×10 −6 K −1 and 12×10 −6 K −1 and the heat sink has a thermal expansion coefficient comprised between 15×10 −6 K −1 and 17×10 −6 K −1 .

11 . A method for manufacturing an integrated circuit package, comprising:

providing a support substrate comprising a mounting face;

providing a heat sink comprising a lateral wall;

forming compartments in the lateral wall of the heat sink;

forming first orifices in the support substrate; and

fastening the lateral wall on the mounting face of the support substrate by fastening devices, the fastening devices being accommodated in the compartments of the lateral wall of the heat sink and crossing the support substrate through the first orifices so as to enable a relative movement of the fastening devices relative to the first orifices.

12 . The method according to claim 11 , wherein the support substrate includes a lower face opposite to the mounting face, wherein fastening the lateral wall on the mounting face comprises riveting by rivets, wherein each rivet comprises a first end accommodated in a corresponding compartment and a second end under the lower face of the support substrate, wherein a distance between the first end and the second end is equal to a thickness of the support substrate increased by a clearance enabling both holding of the lateral wall fastened to the mounting face of the support substrate and movement of each rivet in the first orifice.

13 . The method according to claim 12 , wherein the value of the clearance is comprised between 10 and 20 μm.

14 . The method according to claim 11 , wherein the support substrate includes a lower face opposite to the mounting face, wherein forming the compartments in the lateral wall of the heat sink comprises threading the compartments, and wherein fastening the lateral wall on the mounting face comprises screwing with screws into the threaded compartments while leaving a clearance between the screw heads and the lower face of the support substrate.

15 . The method according to claim 14 , wherein the value of the clearance is comprised between 10 and 20 μm.

16 . The method according to claim 11 , wherein forming first orifices comprises forming each first orifice to have an oblong shape.

17 . The method according to claim 15 , wherein an axis of each oblong shape first orifice in the plane of the mounting face forms a 45° angle with respect to the direction of the two edges of the lateral wall adjacent to this first orifice.

18 . The method according to claim 11 , wherein the heat sink has a lateral wall with an annular shape of a square or rectangular section, and wherein forming first orifices comprises forming four first orifices in the support substrate respectively located opposite the four corner areas of the lateral wall.

19 . The method according to claim 11 , wherein the fastening devices are thermally-conductive.

20 . The method according to claim 11 . wherein the support substrate has a thermal expansion coefficient comprised between 10×10 −6 K −1 and 12×10 −6 K −1 and the heat sink has a thermal expansion coefficient comprised between 15×10 −6 K −1 and 17×10 −6 K −1 .