Patent Assignment
Reel/Frame 066976/0152
Assignment of Assignor's Interest
Recorded: 2024-04-02
Pages: 3
Assignor
CAMPOS, DIDIER
Executed: 2024-02-07
Assignee
STMICROELECTRONICS (GRENOBLE 2) SAS
12 RUE JULES HOROWITZ, GRENOBLE, 38000, FRANCE
Covered Property
(1)
Heat Sink Fastened on the Substrate of a Package of Integrated Circuits
Application:
18/624,320 →
Publication:
US 2024/0339375
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.