Patent Assignment
Reel/Frame 064043/0984
Assignment of Assignor's Interest
Recorded: 2023-06-23
Pages: 7
Assignors
AHN, DUHYOUNG
Executed: 2023-06-09
KANG, MINSEOK
Executed: 2023-06-09
MOON, SUNGWOOK
Executed: 2023-06-09
HONG, YONGJIN
Executed: 2023-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Semiconductor Chips