Patent Assignment
Reel/Frame 064051/0766
Assignment of Assignor's Interest
Recorded: 2023-06-25
Pages: 2
Assignor
SHEN, YUCI
Executed: 2023-06-25
Assignee
IC CHIP COOLING TECHNOLOGIES LLC
1401 21ST STREET SUITE 8218, ATTN: YUCI SHEN, SACRAMENTO, CALIFORNIA, 95811
Covered Property
(1)
Hybrid-Cloth-Based Method for Making Tsv Substrates