Assignment of Assignor's Interest

Recorded: 2023-06-26 Pages: 8

Assignors

HATAYAMA, AKIHIRO

Executed: 2023-06-01

NAKAMURA, SHIGEYA

Executed: 2023-06-01

TOMITA, KYOICHI

Executed: 2023-06-02

KAGAWA, TAKUYA

Executed: 2023-06-01

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN

Covered Property (1)

Molded Body, Automobile Part, and Method for Manufacturing Molded Body

Application: 18/269,679 →

Publication: US 2024/0059047

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.