Patent Assignment
Reel/Frame 064069/0575
Assignment of Assignor's Interest
Recorded: 2023-06-22
Pages: 7
Assignors
LEE, HYOUNGJOO
Executed: 2023-05-08
PARK, SANG-SICK
Executed: 2023-05-09
LEE, CHUNGSUN
Executed: 2023-05-08
JUNG, SEUNGYOON
Executed: 2023-05-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same
Application:
18/213,018 →
Publication:
US 2024/0170449