Patent Assignment
Reel/Frame 064080/0977
Assignment of Assignor's Interest
Recorded: 2023-06-27
Pages: 7
Assignors
IWANAGA, KOHTA
Executed: 2023-04-19
KOTAKE, TOMOHIKO
Executed: 2023-04-19
TSUKAHARA, TOMOAKI
Executed: 2023-04-19
SUZUKI, TAKAYUKI
Executed: 2023-05-08
NAKAMURA, SHOTA
Executed: 2023-05-10
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, TOKYO, 1058518, JAPAN
Covered Property
(1)
Resin Composition, Prepreg, Laminated Plate, Resin Film, Printed Wiring Board, and Semiconductor Package
Application:
18/259,444 →
Publication:
US 2023/0391939
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.