Patent Assignment
Reel/Frame 064085/0311
Assignment of Assignor's Interest
Recorded: 2023-06-27
Pages: 3
Assignors
JIANG, JHENG-HONG
Executed: 2021-04-05
WU, SHING-HUANG
Executed: 2021-04-05
LIU, CHIA-WEI
Executed: 2021-03-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Plasma-Damage-Resistant Interconnect Structure and Methods for Forming the Same