Change of Name

Recorded: 2023-06-28 Pages: 11

Assignor

SHOWA DENKO MATERIALS CO., LTD.

Executed: 2023-01-01

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, JAPAN

Covered Property (1)

Resin Composition, Film, and Cured Product

Application: 18/012,980 →

Publication: US 2023/0250256

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.