Patent Assignment
Reel/Frame 064106/0732
Assignment of Assignor's Interest
Recorded: 2023-06-29
Pages: 5
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package Using Substrate Block Integration
Application:
18/215,830 →
Publication:
US 2024/0038647