IP Library › Assignment 064107/0114
Patent Assignment
Reel/Frame 064107/0114

Change of Name

Recorded: 2023-06-09 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Wafer-Level Bonding of Obstructive Elements
Application: 17/454,971 →
Publication: US 2022/0139849
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Assignment of Assignor's Interest Jun 9, 2023
From: DELACRUZ, JAVIER A.; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 063914/0406 →