Patent Assignment
Reel/Frame 064114/0218
Assignment of Assignor's Interest
Recorded: 2023-06-29
Pages: 6
Assignors
LEE, TAEKEUN
Executed: 2021-06-16
KIM, YOUNGCHEOL
Executed: 2021-06-16
KIM, YOUNGMIN
Executed: 2021-06-16
KIM, YONGMIN
Executed: 2021-06-16
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Hybrid TIM Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.