Patent Assignment
Reel/Frame 064121/0627
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 7
Assignors
KWEON, JUNYUN
Executed: 2022-12-06
KO, YEONGBEOM
Executed: 2022-12-06
KIM, WOOJU
Executed: 2022-12-06
RYU, JUNGSEOK
Executed: 2022-12-06
YOON, JUNHO
Executed: 2022-12-06
LEE, HWAYOUNG
Executed: 2022-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same