Patent Assignment
Reel/Frame 064121/0722
Assignment of Assignor's Interest
Recorded: 2023-06-30
Pages: 3
Assignors
CHANG, JEN-YUAN
Executed: 2023-06-14
KUO, FU-CHIANG
Executed: 2023-06-14
WU, YI-CHU
Executed: 2023-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Application:
18/331,189 →
Publication:
US 2024/0412982