Patent Assignment
Reel/Frame 064122/0389
Assignment of Assignor's Interest
Recorded: 2023-06-30
Pages: 7
Assignors
CHUA, LINDA PEI EE
Executed: 2023-06-27
CHAN, KAI CHONG
Executed: 2023-06-27
ZARATE, ROWENA
Executed: 2023-06-27
ROQUE, MARITES
Executed: 2023-06-27
CHONG, YI JING ERIC
Executed: 2023-06-27
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Inverted EWLB Package with Vertical E-Bar Structure
Application:
18/344,920 →
Publication:
US 2025/0006608