Patent Assignment
Reel/Frame 064130/0123
Assignment of Assignor's Interest
Recorded: 2023-06-30
Pages: 5
Assignors
LU, JING
Executed: 2023-06-28
WEN, HAILANG
Executed: 2023-06-28
LUO, QIUFA
Executed: 2023-06-28
LI, CHEN
Executed: 2023-06-28
AI, TENGFENG
Executed: 2023-06-28
Assignee
HUAQIAO UNIVERSITY
269 CHENGHUA NORTH RD., FENGZE DISTRICT, QUANZHOU CITY, FUJIAN, 362021, CHINA
Covered Property
(1)
Integrated Machining Device for Grinding and Polishing Diamond and Method Thereof
Application:
18/217,001 →
Publication:
US 2023/0339064