Patent Assignment
Reel/Frame 064137/0251
Assignment of Assignor's Interest
Recorded: 2023-07-03
Pages: 3
Assignors
RYU, JIHYEONG
Executed: 2023-06-30
CHO, EUNJUN
Executed: 2023-06-30
KIM, MINSOO
Executed: 2023-06-30
LEE, YOUNGMIN
Executed: 2023-06-30
SEO, HOJIN
Executed: 2023-06-30
Assignee
LG ELECTRONICS INC.
128, YEOUI-DAERO, YEONGDEUNGPO-GU, SEOUL, 07336, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Pump and Method of Operating Heat Pump to Control Power to Boiler Based on Expected Efficiency of Heat Pump