Patent Assignment
Reel/Frame 064142/0512
Assignment of Assignor's Interest
Recorded: 2023-07-04
Pages: 5
Assignors
SOBUE, SHOGO
Executed: 2023-06-08
NAKAMURA, YUKI
Executed: 2023-06-08
OGAWA, SAEKO
Executed: 2023-06-08
IKEDA, DAISUKE
Executed: 2023-06-07
OKAWARA, KEISUKE
Executed: 2023-06-08
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Curable Resin Film, Film Material for Semiconductor Device Production, Curable Resin Composition for Semiconductor Device Production, and Method for Producing Semiconductor Device
Application:
18/255,366 →
Publication:
US 2024/0021443
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.