Assignment of Assignor's Interest

Recorded: 2023-07-04 Pages: 4

Assignors

SOBUE, SHOGO

Executed: 2023-06-08

OGAWA, SAEKO

Executed: 2023-06-08

IKEDA, DAISUKE

Executed: 2023-06-07

OKAWARA, KEISUKE

Executed: 2023-06-08

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Method for Manufacturing Semiconductor Device

Application: 18/255,367 →

Publication: US 2024/0006192

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.