Patent Assignment
Reel/Frame 064158/0989
Assignment of Assignor's Interest
Recorded: 2023-07-06
Pages: 3
Assignor
LIU, HUNG WEN
Executed: 2020-06-08
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Substrate-Free Semiconductor Device Assemblies with Multiple Semiconductor Devices and Methods for Making the Same