Patent Assignment
Reel/Frame 064174/0350
Assignment of Assignor's Interest
Recorded: 2023-07-06
Pages: 4
Assignors
YUH, PERNG-FEI
Executed: 2021-09-21
LEE, CHUN-YING
Executed: 2023-06-04
CHANG, TUNG-CHENG
Executed: 2021-09-21
LI, GU-HUAN
Executed: 2021-09-21
HUANG, CHIA-EN
Executed: 2021-09-21
WANG, YIH
Executed: 2021-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Memory Devices with Diode-Connected Mos