Patent Assignment
Reel/Frame 064197/0952
Assignment of Assignor's Interest
Recorded: 2023-07-10
Pages: 4
Assignor
BOUFNICHEL, MOHAMED
Executed: 2023-07-07
Assignee
STMICROELECTRONICS (TOURS) SAS
16 RUE PIERRE ET MARIE CURIE, TOURS, 37100, FRANCE
Covered Property
(1)
Under-Bump Metallization Structures and Associated Methods of Formation
Application:
18/349,351 →
Publication:
US 2025/0022820
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Street Address of the Recieving Party Previously Recorded at Reel: 64197 Frame: 952. Assignor(S) Hereby Confirms the Assignment.
Feb 14, 2024
From: BOUFNICHEL, MOHAMED
To: STMICROELECTRONICS (TOURS) SAS
Reel/Frame 066598/0133 →
Assignment of Assignor's Interest
Sep 30, 2024
From: STMICROELECTRONICS (TOURS) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068744/0844 →