Patent Assignment
Reel/Frame 064198/0884
Assignment of Assignor's Interest
Recorded: 2023-07-10
Pages: 2
Assignors
SHIN, JONG BAE
Executed: 2023-02-06
LEE, SOO MIN
Executed: 2023-02-06
JEONG, JAE HUN
Executed: 2023-02-06
Assignee
LG INNOTEK CO., LTD.
30, MAGOKJUNGANG 10-RO, GANGSEO-GU, SEOUL, 07796, KOREA, REPUBLIC OF
Covered Property
(1)
Circuit Board and Package Substrate Comprising Same
Application:
18/271,544 →
Publication:
US 2024/0237233