Patent Assignment
Reel/Frame 064199/0616
Assignment of Assignor's Interest
Recorded: 2023-07-10
Pages: 3
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Processing Apparatus Using Laser, Method of Laser Lift-Off and Method of Manufacturing Semiconductor Device
Application:
18/332,508 →
Publication:
US 2024/0096682