Patent Assignment
Reel/Frame 064201/0325
Assignment of Assignor's Interest
Recorded: 2023-07-10
Pages: 4
Assignors
HSIUNG, TE-CHIH
Executed: 2021-03-22
WU, JYUN-DE
Executed: 2021-03-22
WANG, PENG
Executed: 2021-03-22
LIN, HUAN-JUST
Executed: 2021-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Manufacturing Method Thereof
Application:
18/338,730 →
Publication:
US 2023/0335435