Patent Assignment
Reel/Frame 064213/0355
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 9
Assignors
MORITA, KOJI
Executed: 2023-04-25
SHIMOKAWA, RYO
Executed: 2023-05-06
TSUCHIKAWA, SHINJI
Executed: 2023-05-15
KASUGA, KEIICHI
Executed: 2023-04-25
HAYASHI, CHIHIRO
Executed: 2023-04-25
IWASAKI, TOMIO
Executed: 2023-05-12
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, TOKYO, 1058518, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Prepreg, Laminate, Metal-Clad Laminate, Printed Wiring Board, and High-Speed Communication Compatible Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.