Patent Assignment
Reel/Frame 064213/0868
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO,, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Bspdn Structures in Small-Cpp Area and Large-Cpp Area
Application:
18/220,432 →
Publication:
US 2024/0290690