Patent Assignment
Reel/Frame 064215/0542
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 6
Assignors
KIM, JUNHYOUNG
Executed: 2023-06-16
KIM, JIWON
Executed: 2023-06-16
LEE, MINYONG
Executed: 2023-06-16
KIM, DOHYUNG
Executed: 2023-06-21
SUNG, SUKKANG
Executed: 2023-06-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Stack Structure and Semiconductor Package Including the Same
Application:
18/346,921 →
Publication:
US 2024/0203943