Patent Assignment
Reel/Frame 064217/0940
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 5
Assignee
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device with an Electrically Conductive Structure having a Capping Layer Sidewall Directly Contacting a Contact Structure and Manufacturing Method thereof
Application:
18/220,290 →
Publication:
US 2024/0397703