Patent Assignment
Reel/Frame 064233/0305
Assignment of Assignor's Interest
Recorded: 2023-07-12
Pages: 5
Assignors
CHEN, HONG-CHIH
Executed: 2023-05-01
SU, FU-HSIANG
Executed: 2023-05-02
CHIEN, YU-SAN
Executed: 2023-06-02
CHANG, SHIH-HSUN
Executed: 2023-05-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure
Application:
18/312,828 →
Publication:
US 2024/0371873