Patent Assignment
Reel/Frame 064241/0295
Assignment of Assignor's Interest
Recorded: 2023-07-13
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same
Application:
18/348,864 →
Publication:
US 2024/0015946