Patent Assignment
Reel/Frame 064255/0930
Assignment of Assignor's Interest
Recorded: 2023-07-14
Pages: 4
Assignors
LEE, I-CHE
Executed: 2020-10-06
HUANG, HUAI-YING
Executed: 2020-10-06
LEE, YI CHIEN
Executed: 2020-10-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Non-Destructive Inspection of Cell Etch Redeposition