Patent Assignment
Reel/Frame 064259/0825
Assignment of Assignor's Interest
Recorded: 2023-07-14
Pages: 12
Assignors
HADA, MIYAKO
Executed: 2023-06-12
TAKAHASHI, MOTONOBU
Executed: 2023-06-13
MINAMI, MASAKAZU
Executed: 2023-06-12
SAKAGUCHI, YUHEI
Executed: 2023-06-12
SHIMIZU, TORU
Executed: 2023-06-09
FUJII, TETSUO
Executed: 2023-06-12
Assignee
HORIBA STEC, CO., LTD.
11-5, HOKOTATE-CHO, KAMITOBA, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8116, JAPAN
Covered Property
(1)
Analysis Device, Analysis Method, and Analysis Program
Application:
18/222,029 →
Publication:
US 2024/0030013