Patent Assignment
Reel/Frame 064277/0070
Assignment of Assignor's Interest
Recorded: 2023-07-16
Pages: 14
Assignors
HE, RAN
Executed: 2022-03-28
JIAO, HUIFANG
Executed: 2022-03-25
DAI, YUFENG
Executed: 2022-03-27
YANG, GUANGLIN
Executed: 2022-03-25
HO, CHIHON
Executed: 2022-03-25
XIE, RONGHUA
Executed: 2023-05-29
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING,BANTIAN, LONGGANG DISTRICT,, SHENZHEN, 518129, CHINA
Covered Property
(1)
Hybrid Bonding Structure and Hybrid Bonding Method