Patent Assignment
Reel/Frame 064294/0956
Assignment of Assignor's Interest
Recorded: 2023-07-18
Pages: 4
Assignors
HSIEH, TE-HSIEN
Executed: 2021-03-16
CHANG, YU-HSING
Executed: 2021-03-16
CHEN, YI-MIN
Executed: 2021-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via Landing on First and Second Barrier Layers to Reduce Cleaning Time of Conductive Structure