Patent Assignment
Reel/Frame 064301/0529
Assignment of Assignor's Interest
Recorded: 2023-07-18
Pages: 4
Assignors
KANG, RAEYOUNG
Executed: 2023-02-21
KIM, MINKI
Executed: 2023-02-21
LEE, HYUEKJAE
Executed: 2023-02-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
18/212,461 →
Publication:
US 2024/0071995