Patent Assignment
Reel/Frame 064324/0154
Assignment of Assignor's Interest
Recorded: 2023-07-20
Pages: 6
Assignors
SONG, HOJU
Executed: 2023-02-23
KIM, EUNJUNG
Executed: 2023-02-23
NAM, KIHYUNG
Executed: 2023-02-23
PARK, JAEHYUNG
Executed: 2023-02-22
LEE, YUNJAE
Executed: 2023-02-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Devices
Application:
18/355,429 →
Publication:
US 2024/0049445