Patent Assignment
Reel/Frame 064334/0957
Assignment of Assignor's Interest
Recorded: 2023-07-21
Pages: 10
Assignors
LEE, CHIU-TE
Executed: 2023-06-29
LEE, WEN-FANG
Executed: 2023-06-29
HUANG, SHAN-SHI
Executed: 2023-06-29
CHEN, KUAN-CHUAN
Executed: 2023-06-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor structure and manufacturing method thereof
Application:
18/224,057 →
Publication:
US 2024/0429220