Patent Assignment
Reel/Frame 064341/0069
Assignment of Assignor's Interest
Recorded: 2023-07-21
Pages: 4
Assignors
CHEN, CHIH
Executed: 2023-07-12
HE, PIN-SYUAN
Executed: 2023-07-09
SHIE, KIA-CHENG
Executed: 2023-07-08
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
NO.1001, DAXUE RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property
(1)
Package Structure and Method for Fabricating the Same
Application:
18/348,092 →
Publication:
US 2025/0015041