Patent Assignment
Reel/Frame 064358/0621
Assignment of Assignor's Interest
Recorded: 2023-07-24
Pages: 5
Assignors
TSAI, TSUNG-LING
Executed: 2019-04-12
LEE, SHEN-NAN
Executed: 2019-04-12
KHADERBAD, MRUNAL A.
Executed: 2019-04-12
HSU, CHUNG-WEI
Executed: 2019-04-12
WU, CHEN-HAO
Executed: 2019-04-12
TSAI, TENG-CHUN
Executed: 2019-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof